SP-100 sputter coater State of the art technology, working pressure achieved within 4 minutes, consistent uniform coatings – even on curved substrates, optimized deposition processes for different substrates, high deposition rates. Cycle times (typical broadband anti-reflective coating): approx. 8 min Target diameter: 6” Standard target type: Si Refractive index range (visible): 1.46 - 2.05 Refractive index range (NIR): 1.46 - 3.3 Load lock volume: 8 l Built-in chiller power: 1.5 kW Compressed air: 6 bar Sputtering gas: Ar Reactive gases: N2, O2 Substrate carriers: 4 Energy requirements 400 V, 3 phase, 4 kW or 208 V, 3 phase Dimensions (w x d x h) 1120 x 1075 x 1850 mm / 44 x 42 x 73 inches Weight 450 kg / 993 lb Based on many years of thin-film experience this sputtering system the SP-100 reflects the state of the art in precision pulse plasma sputtering technology. The single-target, reactive sputtering principle provides outstanding flexibility for process innovation and simplified operation. Your benefits at a glance: Working pressure is typically attained within 4 minutes for simple AR applications. Sputtering Target is maintained under ideal conditions High purity Silicon can be deposited with excellent optical characteristics Four substrate carriers in planetary drive The optional flip-over planetary drive enables double-sided coating of substrates

Product info SP-100 227.45KB